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Inspection Equipment(IGBT) - List of Manufacturers, Suppliers, Companies and Products

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
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Inspection Equipment Product List

1～15 item / All 17 items

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SG Tech IGBT Burn-in Test Equipment (Automotive Related)

SG Tech IGBT Burn-in Test Equipment (Automotive Related)

We are capable of manufacturing custom inspection equipment for the automotive industry.

- Simultaneous inspection of 356 modules - Set the drawer module by pulling out the shelf and mechanically contact the probe when pushing it into the shelf. - Temperature load of 125 degrees - Varm: 480V / VGE 0V - Inspect leakage current of less than 100μA - Heating for 2 hours → inspection for 2 hours → cooling for 2 hours

  • Other inspection equipment and devices

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IGBT/SiC Power Module Inspection Equipment "NATS Series"

IGBT/SiC Power Module Inspection Equipment "NATS Series"

Low LS 4.5nH! Introducing Nidec Advance Technology's inspection equipment.

We would like to introduce our IGBT/SiC power module testing equipment, the 'NATS Series'. We offer the automatic testing device "NATS-1000," which achieves low LS values and supports high-precision testing for insulation, static characteristics, and dynamic characteristics, as well as the manual testing device "NATS-1630/1730," which can be integrated with external PCs and upper data management systems such as the cloud. Please feel free to contact us when you need assistance. 【Features】 <NATS-1000> ■ Insulation testing (ISO) ■ Static characteristics testing (DC) ■ Dynamic characteristics testing (AC) ■ High-temperature testing up to 175°C (up to 200°C) ■ High throughput of up to 144 UPH (25 seconds/unit) *For more details, please download the PDF or feel free to contact us.

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Wafer chip standalone dynamic characteristic testing device

Wafer chip standalone dynamic characteristic testing device

This is a dynamic characteristic testing device for measuring power devices in chip form. There are also many proven inspection devices for testing in wafer form.

This is a dynamic characteristic measurement device (AC characteristic measurement device) aimed at individual wafer chips of various semiconductors (IGBT, P-MOS FET, SiC, GaN, Diodes, etc.). It enables dynamic characteristic testing during shipping inspections and acceptance inspections of individual chips, as well as during the process before package sealing.

  • Other electronic measuring instruments

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Power module dynamic characteristic testing device

Power module dynamic characteristic testing device

This is a dynamic characteristic testing device for measuring power devices packaged as modules.

Achieves switching time, VCE (SUS), and load short-circuit measurement with a single unit. Ideal for measuring dynamic characteristics (AC characteristics) in high and low temperature environments. Low Ls measurement is possible thanks to Copel Electronics' unique know-how. Chamber for heating/cooling is also available.

  • Other electronic measuring instruments

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Pulse Output Circuit Board Voltage Waveform Inspection Device

Pulse Output Circuit Board Voltage Waveform Inspection Device

Pulse waveforms can be output freely!! Measured waveforms are beautifully reproduced on the monitor!!

- Editing and rearranging inspection steps is possible on the PC monitor. - Inspections combining different pulse output waveform patterns and power voltages can be performed. - Arbitrary pulse waveforms can be output. - A dedicated measuring device is used for thermal resistance, ensuring high precision (communicates with the thermal resistance meter via GPIB). - All inspection results can be saved in a log file. - Measurement waveforms can be viewed on the PC monitor. - Since it uses a Windows PC, the operation is easy to understand. - Simultaneous measurement on 2 channels is possible, allowing for judgment based on the interrelationship of the measurement waveforms.

  • Circuit Board Inspection Equipment
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Appearance inspection equipment for power device chips

Appearance inspection equipment for power device chips

Automating defect inspection with high precision! Achieving no visual inspection through the automation of inspection on all six sides!

This is an appearance inspection device that automates defect inspection of power device chips with high precision. By automating the inspection of all six surfaces, it achieves 2D high-precision defect inspection without visual inspection (target products: chips for IGBTs, power diodes, etc.). In side inspections, focus shifts caused by XYθ misalignment are corrected for each workpiece, ensuring that fine defects are reliably detected with just the right focus. For top and bottom inspections, multi-angle lighting combined with multiple imaging captures inspection images suitable for various defect modes, ensuring that targeted defects are reliably detected. 【Features】 ■ High resolution: High-resolution inspection with a maximum 25Mpix camera ■ Suitable lighting environment: Multi-angle lighting ■ High-speed control and capture: Continuous capture of multiple optimal images for each defect mode *For more details, please refer to the PDF document or feel free to contact us.

  • Visual Inspection Equipment

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Module Static Characteristic Inspection Device

Module Static Characteristic Inspection Device

It is a static characteristic testing device for measuring power devices packaged as modules.

It is a static characteristic (DC characteristic) measuring instrument for various power modules. It supports measurements from microcurrents to high power.

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Chip standalone static characteristic testing device

Chip standalone static characteristic testing device

It is a static characteristic testing device for measuring power devices in a chip-only configuration. There are also many proven testing devices for wafer state.

It is a test device for the static characteristics of the chip (DC characteristics). It supports from microcurrents to high power.

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X-ray imaging service

X-ray imaging service

You can take images with the new X-ray device! Internal CT images of multilayer circuit boards and automatic inspection screens for IC wire bonds, etc.

We would like to introduce our "X-ray imaging service." We can extract only the soldering parts of module components and also perform IGBT inspections, allowing for the detection of hidden voids. The imaging models include FX-300tR2, FX-400tRX, FX-500tRX, IX-1610, and ILX-2000, and we can respond quickly for same-day imaging. 【Specifications】 ■ X-ray output: 90kV, 110kV, 130kV, 160kV ■ X-ray tube current: 60µA to 300µA ■ Geometric magnification: 20x to 2000x ■ Resolution: 0.25µm to 5µm ■ Sample size: up to 510×460mm *For more details, please download the PDF or feel free to contact us.

  • X-ray inspection equipment
  • X-ray Inspection Machine

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Power Module Inspection Device "NSAT Series"

Power Module Inspection Device "NSAT Series"

Wide bandgap measurement technology! Achieving high throughput inspection of up to 144 UPH.

We would like to introduce our IGBT/SiC power module testing equipment, the 'NSAT Series'. The "NATS-1000" is an automatic testing device for insulation/static characteristics/dynamic characteristics. It can be expanded for automatic lines and complies with IEC60747 measurements. The "NATS-1630/1730" is a manual testing device for dynamic characteristics, capable of interfacing with higher-level data management systems such as external PCs or the cloud. 【NATS-1000 Features】 ■ High-temperature testing up to 175℃ (up to 200℃) ■ High throughput of up to 144 UPH (25 seconds/unit) ■ Low LS of 4.5nH ■ Expandable for automatic lines ■ Complies with IEC60747 measurements ■ AOI/warp inspection/laser marking *For more details, please download the PDF or feel free to contact us.

  • Other inspection equipment and devices

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[Example] Provision of thermal resistance contract analysis and thermal resistance testing equipment.

[Example] Provision of thermal resistance contract analysis and thermal resistance testing equipment.

"Industry's first method"! We use our unique technique (patent pending) to derive the correct solution.

- Custom thermal resistance testing equipment - Contract thermal resistance analysis for semiconductor products (both measurement and simulation) With our unique technology, we can verify the thermal resistance analysis of semiconductor products' packages, which contain many ambiguous aspects, with unprecedented accuracy. We have applied for a patent for this "industry-first method."

  • Other temperature and humidity measuring instruments

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3D X-ray observation device FX-300 tRX2/LL with CT

3D X-ray observation device FX-300 tRX2/LL with CT

Support for large substrates up to 600×600mm is also possible! A compact sealed tube type X-ray device that achieves a geometric magnification of 1,000 times.

The "FX-300 tRX2/LL with CT" is a three-dimensional X-ray observation device that employs X-ray stereo technology. It is capable of canceling chip components mounted on the underside of BGA, LGA, QFN, etc. Additionally, a convenient chip counter function (capable of counting quantities in reel state) is now standard. 【Features】 ■ Adopts X-ray stereo technology (unique technology by Ibit) ■ Achieves a geometric magnification of 1,000 times ■ Equipped with a chip counter function ■ High-magnification oblique shooting possible with wide-angle X-ray irradiation ■ An LL model compatible with large substrates of 600×600mm is also available *For more details, please refer to the PDF document or feel free to contact us.

  • X-ray inspection equipment

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3D X-ray observation device that supports X-ray inspection and chip component counting with one unit.

3D X-ray observation device that supports X-ray inspection and chip component counting with one unit.

Equipped with a 1,000 times high-magnification X-ray inspection machine and a convenient chip counter as standard. It can count the quantity of electronic components in about 30 seconds.

The "FX-300 tRX2 with CT" is a three-dimensional X-ray observation device that can inspect the chip components on the underside of a circuit board by canceling them out using its unique "X-ray stereo method." It also comes standard with a chip counter function, allowing it to count the quantity of electronic components such as square chips, ICs, and LEDs in reel form in approximately 20 to 30 seconds. This product supports dual functions for "inspection of BGA, LGA, QFN, etc." and "counting the number of chip components" at a reasonable price. 【Features】 ■ Geometric magnification of 1,000 times ■ Compact sealed tube type ■ Capable of diagonal shooting at high magnification ■ The LL model supports large circuit boards of 600×600mm ■ Optional features such as automatic BGA inspection, vertical CT, and diagonal CT can also be added *For more details, please refer to the PDF document or feel free to contact us.

  • X-ray inspection equipment

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3D X-ray observation device 'FX-300tRX2 with CT'

3D X-ray observation device 'FX-300tRX2 with CT'

A compact sealed tube X-ray device that achieves a geometric magnification of 1,000 times! You can reduce inspection costs.

In conventional X-ray inspections, the chip components on the backside became noise components, making accurate inspections difficult. By using the "X-ray stereo method" developed by I-BIT, it has become possible to cancel out chip components mounted on the backside, such as BGA, LGA, and QFN. In this product, unlike conventional X-ray CT methods, it does not require tomographic images, allowing for high-speed processing. 【Features】 ■ Adoption of X-ray stereo method (our proprietary technology) ■ Achieved geometric magnification of 1,000 times ■ Equipped with chip counter function ■ High-magnification oblique shooting possible with wide-angle X-ray irradiation ■ Measurement of solder rise (solder filling rate) in through-holes is possible *New feature ■ Automatic BGA inspection function (optional) ■ VCT (Vertical CT) and PCT (Oblique CT) functions (optional) *For more details, please refer to the PDF document or feel free to contact us.

  • X-ray inspection equipment

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